{"id":36,"date":"2020-11-25T17:58:31","date_gmt":"2020-11-25T17:58:31","guid":{"rendered":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/?page_id=36"},"modified":"2025-04-26T11:46:34","modified_gmt":"2025-04-26T18:46:34","slug":"publications","status":"publish","type":"page","link":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/publications\/","title":{"rendered":"Publications"},"content":{"rendered":"\t\t
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Referred Journals <\/a>                                                                          Referred Conference Proceedings<\/a><\/p>\n<\/div>\n<\/div>\n

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Books and Book Chapters<\/a>                                                             Selected Invited Talks<\/a><\/p>\n<\/div>\n<\/div>\n

 <\/h4>\n

Refereed Journals<\/strong><\/h4>\n
    \n
  1. T. Kelley, S. Pancrazio, S. Wagner, A. Hossain, N. Tran, and A. Pham, \u201cA Low-cost and Compact Software-Defined UWB Transmitter for Radar Utilizing a Non-Linear Transmission Line,\u201d IEEE Transactions on Radar Systems, Vol. 3, pp. 591-598, March 2025, DOI: 10.1109\/TRS.2025.3554135.<\/li>\n
  2. P. T. Nguyen, N. S. Wagner, A. Stameroff and A. Pham, \u201cAn InP Distributed Active Isolator With> 30-dB Isolation over 215-GHz Bandwidth for Sub-THz Wideband Transceivers,\u201d IEEE Transactions on Terahertz Science and Technology, pp. 1-16, March 2025, DOI: 10.1109\/TTHZ.2025.3550802.<\/li>\n
  3. A. Hossain, S. Wagner, S. Pancrazio, T. Kelley, and A. Pham, \u201cA Compact and Low-Profile High-Gain Multilayer Vivaldi Antenna Based on Gradient Metasurface Superstrates,\u201d IEEE Antennas and Wireless Propagation Letters, DOI: 10.1109\/LAWP.2025.3542315, 2025.<\/li>\n
  4. S. Pancrazio, T. Kelley, S. Wagner, N. Tran, A. Hossain and A. Pham, “Digital Pre-Distortion to Reduce Ringing in a Pulse Sharpening Non-Linear Transmission Line,” IEEE Journal of Microwaves, vol. 5, no. 1, pp. 160-169, Jan. 2025, (DOI: 10.1109\/JMW.2024.3512368.<\/li>\n
  5. Y. Chen, P.-J. Chen, R. Hu, Y. Zhu, J.-H. Yu, A. Pham, O. Momeni, C. Domier, J. Dannenberg, X. Li, and N. Luhmann, “Frontier system-on-chip (SoC) technology for microwave diagnostics (invited),” Review of Scientific Instruments, vol. 95, 2024, (DOI: 10.1063\/5.0219545.)<\/li>\n
  6. P. T. Nguyen, N. L. K. Nguyen, N. S. Wagner, A. Stameroff and A. Pham, “A Balanced Darlington Cell for a 3\u2013230-GHz InP Distributed Amplifier,” IEEE Transactions on Microwave Theory and Techniques, vol. 72, no. 7, pp. 4043-4057, July 2024, (DOI: 10.1109\/TMTT.2023.3339017).<\/li>\n
  7. P. T. Nguyen, T. Shepard, N. Wagner, A. Stameroff and A. Pham, “A 140\u2013210-GHz InP Frequency Doubler Using a Low-Loss Low-Imbalance Marchand Balun,” IEEE Microwave and Wireless Technology Letters, vol. 34, no. 1, pp. 92-95, Jan. 2024, (DOI: 10.1109\/LMWT.2023.3330828).<\/li>\n
  8. P. T. Nguyen, N. Wagner, A. Stameroff and A. Pham, “A 10\u2013230-GHz InP Distributed Amplifier Using Darlington Quadruple-Stacked HBTs,” IEEE Microwave and Wireless Technology Letters, vol. 34, no. 6, pp. 769-772, June 2024, (DOI: 10.1109\/LMWT.2024.3380616).<\/li>\n
  9. A. Hossain and A. Pham, “A Novel Gain-Enhanced Miniaturized and Lightweight Vivaldi Antenna,” in IEEE Transactions on Antennas and Propagation, 2023, DOI: 10.1109\/TAP.2023.3310611.<\/li>\n
  10. J. M. Romero-Arguello, A. Pham, C. S. Gardner and B. T. Funsten, “Design and Implementation of a Wirelessly Powered RFID System Enclosed Inside Metal Containers,” in IEEE Journal of Radio Frequency Identification, vol. 7, pp. 573-581, 2023, DOI: 10.1109\/JRFID.2023.3321885.<\/li>\n
  11. S. Pancrazio, S. Wagner, P. Nguyen, T. Kelley, A. Hossain, N. Tran, A. Pham, “Digital Pre-Distortion to Reduce Ringing in Ultrawideband Radar Systems,” in IEEE Transactions on Radar Systems, vol. 1, pp. 205-211, 2023, DOI: 10.1109\/TRS.2023.3290039.<\/li>\n
  12. A. Alkasimi, A. Pham, C. Gardner and B. Funsten, “Human Activity Recognition Based on 4-Domain Radar Deep Transfer Learning,” 2023 IEEE Radar Conference (RadarConf23), San Antonio, TX, USA, 2023, pp. 1-6, 2023, DOI: 10.1109\/RadarConf2351548.2023.10149668.<\/li>\n
  13. S. Wagner, A. Hossain, S. Pancrazio, and A. Pham, \u201cSystem-based specifications for better design of ground-penetrating radar antennas,\u201d IET Microw., Antennas Propag., vol. 17, no. 6, pp. 478\u2013493, 2023, DOI:10.1049\/mia2.12358.<\/li>\n
  14. A. Alkasimi, A. Pham, C. Gardner, B. Funsten: Geolocation tracking for human identification and activity recognition using radar deep transfer learning. IET Radar Sonar Navig., vol.17, no. 6, pp. 955\u2013966, 2023,  DOI : 10.1049\/rsn2.12390.<\/li>\n
  15. L. K. Nguyen, C. Cui, , D. P. Nguyen, A. N. Stameroff, and A. Pham, “A 7-115 GHz Distributed Amplifier with 24-dBm Output Power Using Quadruple-Stacked HBT in InP,” IEEE Microwave and Wireless Technology Letters, 2023, pp. 1-4 DOI: 10.1109\/LMWT.2023.3237683.<\/li>\n
  16. P. T. Nguyen, S. Pancrazio, A. Pham, A. Karbassi, M. Clements and S. Sacks, “A DC\u201320-GHz Impedance Tuner Using Power-Enhanced Stacked-FET Switch in 45-nm SOI CMOS,” in IEEE Microwave and Wireless Technology Letters, vol. 33, no. 4, pp. 459-462, April 2023, DOI: 10.1109\/LMWT.2022.3220934.<\/li>\n
  17. A. Alkasimi, T. Shepard, S. Wagner, S. Pancrazio, A. Pham, C. Gardner, B. Funsten, \u201cDual-Biometric Human Identification Using Radar Deep Transfer Learning,\u201d Sensors<\/em>, Vol. 22, Issue 15, pp. 5782-5799, 2022, DOI: 10.3390\/s22155782<\/li>\n
  18. S. Wagner, A. Alkasimi, A.Pham, \u201cDetecting the Presence of Intrusive Drilling in Secure Transport Containers Using Non-Contact Millimeter-Wave Radar,\u201d Sensors<\/em>, Vol. 22, Issue 7, pp. 2718-2734, 2022.<\/li>\n
  19. A. Iba, C. W. Domier, M. Ikeda, A. Mase, M. Nakajima, A. Pham, N. C. Luhmann, \u201cSubdiffraction focusing with a long focal length using a terahertz-wave super-oscillatory lens\u201d, Optics Letters<\/em>, Vol. 46, Issue 19, pp. 4912-4915, 2021.<\/li>\n
  20. J. M. Romero-Arguello, A. Pham, C. Gardner, and B. Funsten, \u201cMiniature Coil for Wireless Power and Data Transfer through Aluminum\u201d, Sensors<\/em>, Vol. 21, Issue 22, pp. 7573, 2021.<\/li>\n
  21. N. L. K. Nguyen, B. Nguyen, T. Omori, D. P. Nguyen, R. Moroney, S. D’Agostino, W. Kennan, and A. Pham, \u201cA Wideband SiGe Power Amplifier Using Modified Triple Stacked-HBT Cell\u201d, IEEE Microwave Wireless Components Letters<\/em>, Vol. 31, Issue 1, pp. 52-55, 2021.<\/li>\n
  22. S. Wagner, B. M. Worthmann, and A. -V. Pham, “Minimizing Timing Jitter\u2019s Impact on Ground-Penetrating Radar Array Coupling Signals,” IEEE Transactions on Geoscience and Remote Sensing<\/em>, Vol. 59, Issue 6, pp. 4717-4724, 2021. <\/li>\n
  23. D. P. Nguyen, X. Tran, A. Pham, \u201cA Wideband High Dynamic Range Triple-stacked FET Dual Shunt Distributed Analog Voltage Controlled Attenuator\u201d, IET Microwaves, Antennas & Propagation<\/em>, Vol. 15, Issue 5, pp. 474-480, 2020.<\/li>\n
  24. N. L.K. Nguyen, N. Killeen, D. P. Nguyen, A. N. Stameroff, and A. Pham, \u201cA Wideband Gain Enhancement Technique for Distributed Amplifiers,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 68, Issue 9, pp. 3697 \u2013 3708, 2020.<\/li>\n
  25. V. Camarchia, R. Quaglia, A. Piacibello, D. P Nguyen, H. Wang, and A. Pham, \u201cA Review of Technologies and Design Techniques of Millimeter-Wave Power Amplifiers,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 68, Issue 7 Part 2, pp. 2957 \u2013 2983, 2020.<\/li>\n
  26. D. Nguyen, N. L.K. Nguyen, A. Stameroff, V. Camarchia, M. Pirola, and A. Pham, \u201cA Wideband Highly Linear Distributed Amplifier Using Intermodulation Cancellation Technique for Stacked-HBT Cell,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 68, Issue 7 Part 2, pp. 2984 \u2013 2997, 2020.<\/li>\n
  27. N. L.K. Nguyen, D. Nguyen, A. Stameroff, and A. Pham, \u201cA 1-160 GHz InP Distributed Amplifier Using 3-D Interdigital Capacitors,\u201d IEEE Microwave Wireless Components Letters<\/em>, Vol. 30, Issue 5, pp. 492-495, 2020.<\/li>\n
  28. S. Wagner and A. Pham, \u201cThe Ultrawideband Elliptical Resistively-Loaded Vee Dipole,\u201d IEEE Transactions on Antennas and Propagation<\/em>, Vol. 68, Issue 4, pp. 2523-2530, 2019.<\/li>\n
  29. M. S. Clements, A. Pham, J. S. Sacks, and S. E. Avery, \u201cSecond-Harmonic Injection Linearization of Millimeter-Wave FET Resistive Mixers,\u201d IEEE Microwave Wireless Components Letters<\/em>, Vol. 29, Issue 10, pp. 669-672, 2019.<\/li>\n
  30. Chi Pham and A. Pham, \u201cNovel Stacked-Defected Ground Structures for Ultra-Wideband Low Loss Balun Designs,\u201d Microwave and Optical Technology<\/em> Letters<\/em>, Vol. 61, Issue 8, pp. 2008-2012, 2019.<\/li>\n
  31. Thuy T Nguyen, Kohei Fujii, A. Pham, \u201cA 4-20 GHz, Multi-Watt Level, Fully-Integrated Push-Pull Distributed Power Amplifier with Wideband Even-Order Harmonic Suppression,\u201d IET Microwaves, Antennas & Propagation<\/em>, Vol. 13, Issue 13, pp. 2279-2283, 2019.<\/li>\n
  32. Duy P Nguyen, Binh L Pham, A. Pham, \u201cA Compact Ka-Band Integrated Doherty Amplifier With Reconfigurable Input Network,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 67, Issue 1, pp. 205-215, January 2019.<\/li>\n
  33. J-H Yu, Y-T Chang, K-Y Lin, C-C Chang, S-F Chang, Y Ye, A. Pham, B. Tobias, Y. Zhu, C. Domier, N. C. Luhmann Jr, \u201cMillimeter-wave system-on-chip advancement for fusion plasma diagnostics,\u201d Review of Scientific Instruments<\/em>, Vol. 89, Issue 10, pp. 10H108, October 2018.<\/li>\n
  34. J-H Yu, Y-T Chang, K-Y Lin, C-C Chang, S-F Chang, Y Ye, A. Pham, B. Tobias, Y. Zhu, C. Domier, N. C. Luhmann Jr, \u201cLiquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak,\u201d Review of Scientific Instruments<\/em>, Vol. 89, Issue 10, pp. 10H120, October 2018.<\/li>\n
  35. Duy P Nguyen, Thanh Pham, A. Pham, \u201cA 28-GHz Symmetrical Doherty Power Amplifier Using Stacked-FET Cells,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 66, Issue 6, pp. 2628-2637, June 2018.<\/li>\n
  36. Chi Van Pham, A. Pham, Robert E Leoni, \u201cDesign of 600-W Low-Loss Ultra-Wideband Ferriteless Balun,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 66, Issue 2, pp. 902-910, February 2018.<\/li>\n
  37. Duy P Nguyen, Jeffery Curtis, A. Pham, \u201cA Doherty amplifier with modified load modulation scheme based on load\u2013pull data,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 66, Issue 1, pp. 227-236, January 2018.<\/li>\n
  38. Thuy T Nguyen, Kohei Fujii, A. Pham, \u201cHighly Linear Distributed Mixer in 0.25- Enhancement-Mode GaAs pHEMT Technology,\u201d IEEE Microwave and Wireless Components Letter<\/em>, Vol. 27, Issue 12, pp. 116-118, December 2017.<\/li>\n
  39. Duy P Nguyen, Binh L Pham, A. Pham, \u201cA 1.5\u201345-GHz High-Power 2-D Distributed Voltage-Controlled Attenuator,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 65, Issue 11, pp. 4208-4217, November 2017.<\/li>\n
  40. Y. Wang, B. Tobias, Y.-T. Chang, J.-H. Yu, M. Li, F. Hu, M. Chen, M. Mamidanna, T. Phan, A.-V. Pham, J. Gu, X. Liu, Y. Zhu, C.W. Domier, L. Shi, E. Valeo, G. J. Kramer, D. Kuwahara, Y. Nagayama, A. Mase, and N.C. Luhmann Jr, \u201cMillimeter-wave imaging of magnetic fusion plasmas: technology innovations advancing physics understanding,\u201d Nuclear Fusion<\/em>, vol. 57, pp. 1-19, March 2017.<\/li>\n
  41. T. Nguyen, A. Riddle, K. Fujii, A. Pham, \u201cDevelopment of wideband and high IIP3 millimeter-wave mixers,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Issue 99, March 2017.<\/li>\n
  42. M. Darwish and A. Pham, \u201cDevelopment of a Parallel-FET Linearization Technique for High Efficiency GaN Power Amplifiers,\u201d IEEE Microwave and Wireless Components Letter<\/em>, vol.27, no.2, pp.1-3, Feb. 2017.<\/li>\n
  43. B. Tobias, C. W. Domier, N. C. Luhmann Jr., C. Luo, M. Mamidanna, T. Phan, A.-V. Pham and Y. Wang. \u201cLow-noise Heterodyne Receiver for Electron Cyclotron Emission Imaging and Microwave Imaging Reflectometry,\u201d AIP Review of Scientific Instruments<\/em>, 87, pp. 11E103-1- 11E103-3, 2016.<\/li>\n
  44. Duy P. Nguyen, Anh-Vu Pham and Farshid Aryanfar, \u201cA K-Band High Power and High Isolation Stacked-FET Single Pole Double Throw MMIC Switch Using Resonating Capacitor,\u201d IEEE Microwave and Wireless Components Letter<\/em>, Vol. 26, No. 9, pp. 696-699, September 2016.<\/li>\n
  45. J. Curtis, A. Pham and F. Aryanfar, \u201cKa-band Doherty Power Amplifier with 26.9 dBm Output Power, 42% PAE and 32% back-off PAE Using GaAs pHEMT\u2019s,\u201d IET Journal of Microwaves, Antennas & Propagation<\/em>, Vol. 10, Issue 10, pp. 1101-1105, 2016<\/li>\n
  46. D. P. Nguyen and Anh-Vu Pham, \u201cAn Ultra Compact Watt-Level Ka-band Stacked-FET Power Amplifier,\u201d IEEE Microwave and Wireless Components Letters<\/em>, Vol. 26, Issue 7, pp. 516-518, 2016<\/li>\n
  47. B. L. Pham, H. Ta, A. Pham, R. Leoni, and Y. Leviatan, \u201c23:1 Bandwidth Ratio Quasi-Lumped Component Balun on a Multilayer Organic Substrate,\u201d IET Journal of Microwaves, Antennas & Propagation<\/em>, Vol. 10, Issue 5, pp. 561-567, 2016<\/li>\n
  48. J. Jeon, J. Chang; A. V. Pham, \u201cCharacterization, Analysis and Implementation of Integrated Bandstop Structures On Ultra-wide Band Archimedean Spiral Antenna,\u201d IEEE Transactions on Antennas and Propagation<\/em>, Vol. 65, No. 5, pp. 1999-2004, May 2016.<\/li>\n
  49. H. Ta and A.-V. Pham \u201cCompact Wide Stopband Band-pass Filter on Multilayer Organic Substrate\u201d IEEE Microwave and Wireless Components Letters<\/em>, pp. 161-163, Vol. 24, Issue 3, 2014.<\/li>\n
  50. J. C. Chieh, B. Pham, A.-V. Pham, G. Kannell, and A. Pidwerbetsky, \u201cMillimeter-wave Dual Polarized High Isolation Antennas and Arrays on Organic Substrates,\u201d IEEE Transactions on Antennas and Propagation<\/em>, Vol. 61, Issue 12, pp. 5948-5957, 2013<\/li>\n
  51. A. N. Stameroff, H. Ta, A. Pham, and R. E. Leoni, \u201cWide bandwidth power-combining and inverse class-F GaN power amplifier at X-band,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 61, Issue 3, pp. 1291-1300, 2013.<\/li>\n
  52. J. C. Chieh and A.-V. Pham, \u201cA Bidirectional Microstrip X-Band Antenna Array on Liquid Crystal Polymer for Beamforming Applications,\u201d IEEE Transactions on Antennas and Propagation<\/em>, Vol. 61, Issue 6, pp. 3364-3368, 2013.<\/li>\n
  53. H. Ta and A.-V Pham, \u201cDual Band Band-Pass Filter With Wide Stopband on Multilayer Organic Substrate\u201d IEEE Microwave and Wireless Components Letters<\/em>, Vol. 23, Issue 4, pp. 193-195, 2013.<\/li>\n
  54. J. C. Chieh, A.-V Pham, A. Pidwerbetsky, and G. Kannell \u201cA Low Cost 8 \u00d7 8 W-Band Substrate Integrated Waveguide Antenna Array Detector on LCP,\u201d Microwave and Optical Technology Letters<\/em>, Vol. 55, No. 8, pp. 1825-1830, 2013.<\/li>\n
  55. H. Ta and A.-V. Pham, \u201cA Compact Broadband Balun on Multilayer Organic Substrate,\u201d Microwave and Optical Technology Letters<\/em>, Vol. 55, No. 8, pp. 1957-1959, 2013.<\/li>\n
  56. H. Ta, B. L. Pham, and A.-V. Pham, \u201cCompact Wide Bandwidth Balun Based on Modified Asymmetric Broadside Coupled Lines,\u201d IEEE Microwave and Wireless Components Letters<\/em>, Vol. 22 , Issue 12, pp. 624-626, 2012.<\/li>\n
  57. K. Aihara, M. J. Chen, C. Chen, and A. Pham, \u201cReliability of Liquid Crystal Polymer air cavity packaging,\u201d IEEE Transaction on Components, Packaging, and Manufacturing Technology<\/em>, Vol. 2, No. 2, pp. 224-230, 2012.<\/li>\n
  58. A. Pham, \u201cPackaging with Liquid Crystal Polymer,\u201d IEEE Microwave Magazine<\/em>, Vol. 12, Issue 5, pp. 83-91, 2011.<\/li>\n
  59. Jia-Chi S. Chieh and A. Pham, \u201cDevelopment of a wide bandwidth Wilkinson power divider on multilayer organic substrates,\u201d Microwave and Optical Technology Letters<\/em>, Vol. 52, Issue 7, pp. 1606-1609, 2010.<\/li>\n
  60. H. Ta and A. Pham, \u201cDevelopment of a compact broadband folded hybrid coupler on multilayer organic substrate,\u201d IEEE Microwave and Wireless Components Letters<\/em>, Vol. 20, Issue 2, pp. 76-78, 2010.<\/li>\n
  61. C. A. Chen, A. Pham, and R. E Leoni, \u201cA novel broadband even-mode matching network for Marchand baluns,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 57, Issue 12, pp. 2973-2980, 2009.<\/li>\n
  62. K. Aihara, Z. Zhang, A-V. Pham, D. Zeeb, T. Flack and E. Stoneham, \u201cDevelopment of multilayer Liquid Crystal Polymer Ka-band downconverter modules,\u201d Microwave and Optical Technology Letters<\/em>, Vol. 51, No. 2, pp. 364-367, 2009.<\/li>\n
  63. M. J. Chen, Z. Zhang, A-V. H. Pham and D. Hyman, \u201cDesign and development of a broadband amplitude compensated long time delay circuit on thin-film Liquid Crystal Polymer,\u201d Microwave and Optical Technology Letters<\/em>, Vol. 51, No. 4, pp. 1060-1063, 2009.<\/li>\n
  64. K. Aihara, M. J. Chen, and A. Pham, \u201cDevelopment of thin-film Liquid Crystal Polymer surface mount packages for Ka-band applications,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 56, Issue 9, pp. 2111-2117, 2008.<\/li>\n
  65. S.-W Seo, J. Yan, J.-H Baek, F. M. Soares, R. Broeke, A.-V. Pham, and S. J. B. Yoo, \u201cMicrowave velocity and impedance tuning of traveling-wave modulator using ion implantation for monolithic integrated photonic systems,\u201d Microwave and Optical Technology Letters<\/em>, Vol. 50, No. 8, pp. 2151-2155, 2008.<\/li>\n
  66. M. McGrath and A.-V. H. Pham, \u201cMicrowave based ammonia detection with vertically aligned carbon nanotube arrays,\u201d ASP Sensor Letters<\/em>, Vol. 6, pp. 719-722, 2008.<\/li>\n
  67. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, \u201cMultilayer organic multi-chip module implementing hybrid microelectromechanical systems,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 56, No. 4, pp. 952-958, April 2008.<\/li>\n
  68. C. Lu, A. Pham, M. Shaw, and C. Saint, \u201cLinearization of CMOS broadband power amplifiers through combined multigated transistors and capacitance compensation,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 55, pp. 2320-2328, November, 2007.<\/li>\n
  69. A. C. Chen, M. J. Chen and A. Pham, \u201cDesign and Fabrication of Ultra-Wideband Baluns Embedded in Multilayer Liquid Crystal Polymer Flex,\u201d IEEE Transactions on Advanced Packaging<\/em>, Vol. 30, No. 3, pp. 533-540, August 2007.<\/li>\n
  70. R. G. Broeke, J. Cao, C. Ji, Sang-Woo Seo, Y. Du, N. K. Fontaine, Jong-Hwa Baek, John Yan, F. M. Soares, F. Olsson, S. Lourdudoss, A. V. Pham, M. Shearn, A. Scherer, S. J. B. Yoo, \u201cOptical-CDMA in InP,\u201d IEEE Journal of IEEE Journal of Selected Topics in Quantum Mechanics<\/em>, Vol. 13, No. 5, pp. 1497-1507, Sept. 2007.<\/li>\n
  71. S. J. B. Yoo, J. P. Heritage, V. Hernandez, R. Scott, W. Cong, N. Fontaine, R. Broeke, J. Cao, S.-W. Seo, J.-H. Baek, F. Soares, Y. Du, C. Yang, W. Jiang, K. Aihara, Z. Ding, B. Kolner, A.-V Pham, S. Lin, F. Olsson, Y. Sun, S. Lourdudoss, K.Y. Liou, S.N.G. Chu, R. Hamm, B. Patel, W.S. Hobson, J. R. Lothian, S. Vatanapradit, L. Gruezke, W. T. Tsang, M. Shearn, and A. Scherer \u201cSpectral phase encoded time spread (SPECTS) optical code division multiplex access technology for next generation communication networks,\u201d OSA Journal of Optical Networks<\/em>, Vol. 6, Issue 10, pp. 1210-1227, April 2007.<\/li>\n
  72. A. Keerti and A.-V Pham, \u201cRF characterization of SiGe HBT power amplifiers under load mismatch,\u201d IEEE Transactions on Microwave Theory and<\/em> Techniques,<\/em> Vol. 55, Issue 2, pp. 207\u2013214, February 2007.<\/li>\n
  73. J. Cao, R. G. Broeke, N. K. Fontaine, C. Ji, Y. Du, N. Chubun, K. Aihara, A.-V. Pham, F. Olsson, S. Lourdudoss, S. J. B. Yoo, \u201cDemonstration of spectral phase O-CDMA encoding and decoding in monolithically integrated arrayed-waveguide-grating-based encoder,\u201d IEEE Photonics Technology Letters<\/em>, Vol. 18, Issue 24, pp. 2602-2604, Dec. 15, 2006.<\/li>\n
  74. M. Mcgrath and A. Pham, \u201cCarbon nanotube based microwave resonator gas sensors,\u201d International Journal of High Speed Electronics and Systems<\/em>, vol. 16, no. 4, pp. 913-935, December 2006. (Invited)<\/li>\n
  75. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, \u201cDesign and Development of a package using LCP for RF\/Microwave MEMS switches,\u201d IEEE Transaction on Microwave Theory and Techniques<\/em>, Vol. 54, Issue 11, pp.4009-4015, Nov. 2006.<\/li>\n
  76. Chao Lu, A. Pham, and Darrell Livezey, \u201cOn the feasibility of CMOS multi-band phase shifters for multiple-antenna transmitters,\u201d IEEE Microwave and Wireless Components Letters<\/em>, Vol. 16, pp. 255 \u2013 257, Issue 5, May 2006.<\/li>\n
  77. A. Keerti, J. Xiang, and A. Pham, \u201cHigh power linearized RF phase shifter using anti-series diodes,\u201d IEEE Microwave and Wireless Components Letters<\/em>, Vol. 16, Issue 4, pp. 200 \u2013 202, April 2006.<\/li>\n
  78. C. Lu, A. Pham, and Darrell Livezey, \u201cDevelopment of multi-band phase shifters in 180 nm RF CMOS technology with active loss compensation,\u201d IEEE Transactions on Microwave Theory and Tech.<\/em>, Vol. 54, Issue 1, pp. 40 \u2013 45, Jan. 2006.<\/li>\n
  79. A. C. Chen, A. Pham, and R. E. Leoni, III, \u201cDevelopment of low-loss, broadband planar baluns using multilayered organic thin-films,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, Vol. 53, Issue11, pp. 3648-3655, Nov. 2005.<\/li>\n
  80. S. Chopra, K. McGuire, N. Gothard, A. M. Rao, and A. Pham, \u201cSelective gas detection using a carbon nanotube sensor,\u201d Applied Physics Letters<\/em>, vol. 38, no. 11, pp. 2280 \u2013 2282, September 2003.<\/li>\n
  81. A. Keerti and A. Pham, \u201cSiGe power devices for 802.11a wireless LAN applications at 5 GHz,\u201d IEE Electronics Letters<\/em>, vol. 39, no. 16, pp. 1218-1220, August 2003.<\/li>\n
  82. S. Chopra, K. McGuire, N. Gothard, A.M. Rao, and A. Pham, \u201cSelective gas detection using a carbon nanotube sensor,\u201d Applied Physics Letters<\/em>, vol. 38, no. 11, September 2003.<\/li>\n
  83. S. Manohar, A. Pham, J. Brown, R. Borges, and K. Linthicum, \u201cMicrowave GaN-based power transistors on large-scale silicon wafers,\u201d International Journal of High Speed Electronics and Systems<\/em>, vol. 13, no. 1, pp. 265-275, 2003 (Invited)<\/li>\n
  84. S. Manohar, A. Pham, and N. Evers \u201cDirect determination of the bias-dependent series parasitic elements in SiC MESFETs,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, vol. 51, pp. 597-600, Feb. 2003.<\/li>\n
  85. D. Newlin, A. Pham, and J. Harriss, \u201cDevelopment of low loss organic-micromachined interconnects on silicon at microwave frequencies,\u201d IEEE Transactions on Components and Packaging Technologies<\/em>, vol. 25, pp. 506-510, September 2002.<\/li>\n
  86. S. Chopra, A. Pham, J. Gaillard, A. Parker, and A. M. Rao, \u201cCarbon-nanotube-based resonant-circuit sensor for ammonia,\u201d Applied Physics Letters<\/em>, vol. 80, no. 24, p. 4632, June 2002.<\/li>\n
  87. R. Ramachandran and A. Pham, \u201cDevelopment of RF\/Microwave on-chip inductors using an organic micromachining process,\u201d IEEE Transactions on Advanced Packaging<\/em>, vol. 25, pp. 244-247, May 2002.<\/li>\n
  88. A. Pham, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, \u201cDevelopment of integral passive components for multilayer organic MCMs at millimeter wave frequencies,\u201d IEEE Transaction on Advanced Packaging<\/em>, vol. 25, pp. 98-101, Feb. 2002.<\/li>\n
  89. A. Pham, R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, \u201cDevelopment of a millimeter wave system on a package utilizing an MCM process,\u201d IEEE Transactions on Microwave Theory and Techniques<\/em>, pp. 1747-1749, Oct. 2001.<\/li>\n
  90. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, \u201cDevelopment of microwave multilayer plastic-based multichip modules,\u201d IEEE Transactions on Advanced Packaging<\/em>, pp. 37-40, Feb. 2001.<\/li>\n
  91. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, \u201cRF\/microwave characterization of multilayer ceramic-based MCM technology\u201d IEEE Transactions on Advanced Packaging<\/em>, pp. 326-331, August 1999.<\/li>\n
  92. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, \u201cUltra low loss millimeter wave multichip module interconnects,\u201d IEEE Transactions on Component Packaging Manufacturing Technologies<\/em>, vol. 21, pp. 302-308, August 1998.<\/li>\n
  93. C. Chun, A. Pham, B. Hutchison, and J. Laskar \u201cDevelopment of microwave package models utilizing on-wafer measurement techniques,\u201d IEEE Transactions Microwave Theory Techniques<\/em>, pp.1948-1954, October 1997.<\/li>\n<\/ol>\n

    Referred Conference Proceedings<\/h4>\n
      \n
    1. T. Kelley, D. Stierli, S. Pancrazio, S. Rahgozar, and A. Pham, \u201cAn Ultra-Wideband Stepped Pulse Ground Penetration Radar Transmitter,\u201d to be presented at IEEE International Symposium on Antennas & Propagation and North American Radio Science Meeting, Ottawa, Canada, July 2025.<\/li>\n
    2. T. Kelley, R. Bruch, S. Rahgozar, and A. Pham, \u201cComparing Pulsed and FMCW Ground Penetration Radar,\u201d to be presented at IEEE International Symposium on Antennas & Propagation and North American Radio Science Meeting, Ottawa, Canada, July 2025.<\/li>\n
    3. P. T. Nguyen, V. -A. Ngo, N. Tran, N. Wagner, A. N. Stameroff and A. Pham, \u201cA 100-180-GHz InP Distributed Frequency Doubler with 11.5 dBm Peak Output Power using a Power-Bandwidth Enhancement Technique,\u201d to be presented at IEEE International Microwave Symposium, San Francisco, CA, 2025.<\/li>\n
    4. P. T. Nguyen, V. -A. Ngo, N. Tran, N. Wagner, A. N. Stameroff and A. Pham, \u201cA 4-240-GHz InP Variable-Gain Amplifier Using an Analog-Controlled Input Attenuation Network,\u201d to be presented at IEEE International Microwave Symposium, San Francisco, CA, 2025.<\/li>\n
    5. T. Shepard, P. T. Nguyen, N. Wagner, A. N. Stameroff and A. Pham, \u201cA 220-280 GHz InP Frequency Doubler with a Compact, Low-Loss Folded Marchand Balun,\u201d to be presented at IEEE International Microwave Symposium, San Francisco, CA, 2025.<\/li>\n
    6. C. Cui, N. L. K. Nguyen, P. T. Nguyen, N. Wagner, A. N. Stameroff and A. Pham, \u201cA 208 GHz InP Distributed Amplifier with Combining Loss Reduction Techniques,\u201d to be presented at IEEE International Microwave Symposium, San Francisco, CA, 2025.<\/li>\n
    7. S. Pancrazio, T. Kelley, A. Hossain, N. Tran and A. Pham, “The Impact of Vibration on TNR for a GPR System,” 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA, 2023, pp. 1795-1796, (DOI: 10.1109\/USNC-URSI52151.2023.10237998).<\/li>\n
    8. T. Kelley, S. Pancrazio, P. Emani, N. Tran and A. Pham, “A Non-Linear Transmission Line with Secondary Soliton Decimation,” 2023 20th European Radar Conference (EuRAD), Berlin, Germany, 2023, pp. 452-455, doi: 10.23919\/EuRAD58043.2023.10289551.<\/li>\n
    9. S. Pancrazio, P. T. Nguyen, A. Pham, M. Clements, A. Karbassi and S. Sacks, “A Low Loss Wideband DC-67 GHz SP3T Switching Network on 45nm SOI-CMOS Process,” 2022 IEEE Ninth International Conference on Communications and Electronics (ICCE), Nha Trang, Vietnam, 2022, pp. 229-232, doi: 10.1109\/ICCE55644.2022.9852045.<\/li>\n
    10. J. M. Romero-Arguello, A. -V. Pham, C. S. Gardner and B. T. Funsten, “Long Distance Through Metal Wireless Power Transfer System,” 2022 Wireless Power Week (WPW), Bordeaux, France, 2022, pp. 378-382, doi: 10.1109\/WPW54272.2022.9853869.<\/li>\n
    11. P. T. Nguyen, N. L. K. Nguyen, A. N. Stameroff and A. Pham, “A Review of Millimeter-wave InP Distributed Amplifiers,” 2022 IEEE 22nd Annual Wireless and Microwave Technology Conference (WAMICON), Clearwater, FL, USA, 2022, pp. 1-4, doi: 10.1109\/WAMICON53991.2022.9786158.<\/li>\n
    12. S. Pancrazio, P. Nguyen, S. Wagner, A. Hossain and A. Pham, “Digital Pre-Distortion to Correct UWB Pulses in a Boresight Test,” 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS\/URSI), Singapore, Singapore, 2021, pp. 525-526, doi: 10.1109\/APS\/URSI47566.2021.9704281.<\/li>\n
    13. A. Hossain, S. Wagner, S. Pancrazio and A. Pham, “A Compact Low-Cost and Lightweight 3-D Printed Horn Antenna for UWB Systems,” 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS\/URSI),Singapore,Singapore,2021,pp.51-52,doi: 10.1109\/APS\/URSI47566.2021.9704737.<\/li>\n
    14. A. Hossain, S. Wagner, S. Pancrazio and A. Pham, “An Electrically Smaller Ultra-Wideband Monopole Antenna for Ground Penetrating Radar Application,” 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting(APS\/URSI),Singapore,Singapore,2021,pp.485-486,doi: 10.1109\/APS\/URSI47566.2021.9704634.<\/li>\n
    15.  S. Wagner, S. Pancrazio, A. Hossain and A. Pham, “Experimental Detection of Buried Sub-mm Diameter Wires Using Microwave Ground-Penetrating Radar,” 2021 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), Singapore, Singapore, 2021, pp. 37-38, doi: 10.23919\/USNC-URSI51813.2021.9703496.<\/li>\n
    16. J. M. Romero-Arguello, A. Pham, C. Gardner, and B. Funsten, \u201cMiniature Coil Design for Through Metal Wireless Power Transfer,\u201d Proceedings of IEEE Wireless Power Transfer Conference<\/em> (WPTC), San Diego, USA, 2021.<\/li>\n
    17. S. Wagner, and A. Pham, \u201cStandoff Non-Line-of-Sight Vibration Sensing Using Millimeter-Wave Radar,\u201d Proceedings of IEEE 17th European Radar Conference <\/em>(EuRAD), Jaarbeurs Utrecht, The Netherlands, 2021.<\/li>\n
    18. N. L.K. Nguyen, D. P. Nguyen, A. N. Stameroff, and A. Pham, \u201cA High Output Power 1 \u2013 150 GHz Distributed Power Amplifier in InP HBT Technology,\u201d Proceedings of IEEE Asia-Pacific Microwave Conference <\/em>(APMC), Hong Kong, 2020 (Best paper award in Microwaves<\/strong>).<\/li>\n
    19. A. Iba, C. W. Domier, M. Ikeda, A. Mase, A. Pham, and N. C. Luhmann, \u201cRealizing sub-diffraction focusing for terahertz,\u201d Proceedings of IEEE 44th International Conference on Infrared, Millimeter, and Terahertz Waves<\/em> (IRMMW-THz), Paris, France, 2019.<\/li>\n
    20. S. Wagner and A. Pham, \u201cStructural effect on image quality degradation in ground-penetrating radar array,\u201d Proceedings of IEEE International Symposium on Antennas and Propagation & USNC\/URSI National Radio Science Meeting, <\/em>Atlanta, GA, <\/em>2019.<\/em><\/li>\n
    21. D. P. Nguyen, X. T. Tran, N. L. K. Nguyen, P. T. Nguyen, and A. Pham, \u201cA Wideband high efficiency Ka-Band MMIC power amplifier for 5G wireless communications,\u201d Proceedings of IEEE International Symposium on Circuits and Systems<\/em> (ISCAS), Hokkaido, Japan, 2019.<\/li>\n
    22. S. Wagner, G. Le and A. Pham, \u201cUltrawideband compact 50:200 Ohm Guanella balun using asymmetric broadside-coupled lines,\u201d Proceedings of IEEE Asia-Pacific Microwave Conference (APMC), pp. 485-487<\/em>, Kyoto, Japan, 2018.<\/li>\n
    23. G. Le, S. Wagner, C. Pham, J. S. Gomez-Diaz and A. Pham, \u201cInverted-F antenna radiation efficiency enhancement based on a slotted ground,\u201d Proceedings of IEEE International Symposium on Antennas and Propagation & USNC\/URSI National Radio Science Meeting<\/em>, pp. 307-308, Boston, MA, 2018.<\/li>\n
    24. S. Wagner, A. Pham, S. Bond and J. Jeon, \u201cDesign of a wideband resistively loaded vee dipole fed by an even-mode matched Marchand balun,\u201d Proceedings of IEEE International Symposium on Antennas and Propagation & USNC\/URSI National Radio Science Meeting<\/em>, pp. 1353-1354, Boston, MA, 2018.<\/li>\n
    25. C. V. Pham, T. A. Vu, W. Tran, A. Pham and C. S. Gardner, \u201cWireless energy harvesting system through metal for aerospace sensor,\u201d Proceedings of IEEE Transportation Electrification Conference and Expo (ITEC)<\/em>, pp. 545-549, Long Beach, CA, 2018.<\/li>\n
    26. D. P. Nguyen, N. L. K. Nguyen, A. N. Stameroff and A. Pham, \u201cA highly linear InP distributed amplifier using ultra-wideband intermodulation feedforward linearization,\u201d  Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1356-1359, Philadelphia, PA, 2018.<\/li>\n
    27. M. S. Clements, A. Pham, J. S. Sacks, B. C. Henderson and S. E. Avery, \u201cComparison of highly linear resistive mixers in depletion and enhancement mode GaAs and GaN pHEMTs at Ka-Band,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 435-438, Philadelphia, PA, 2018.<\/li>\n
    28. N. S. Killeen, D. P. Nguyen, A. N. Stameroff, A. Pham and P. J. Hurst, \u201cDesign of a wideband bandpass stacked HBT distributed mmplifier in InP,\u201d Proceedings of IEEE International Symposium on Circuits and Systems (ISCAS)<\/em>, pp. 1-5, Florence, Italy, 2018.<\/li>\n
    29. C. Van Pham, B. Sawtelle, S. Imbach, A. Pham and Jironghe, \u201cAn automated fault detection program for multichannel bandwidth-limited system,\u201d Proceedings of 89th ARFTG Microwave Measurement Conference (ARFTG)<\/em>, pp. 1-4, Honolulu, HI, 2017.<\/li>\n
    30. B. C. Henderson, S. E. Avery, J. S. Sacks, M. S. Clements and A. Pham, \u201cWideband GaAs MMIC diode frequency doubler using 4:1 broadside coupled balun,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 957-960, Honolulu, HI, 2017.<\/li>\n
    31. M. Darwish and A. Pham, \u201cAn extended symmetric doherty power amplifier with high efficiency over a wide power range,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1118-1121, Honolulu, HI, 2017.<\/li>\n
    32. D. P. Nguyen, B. L. Pham, T. Pham and A. Pham, \u201cA 14\u201331 GHz 1.25 dB NF enhancement mode GaAs pHEMT low noise amplifier,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1961-1964, Honolulu, HI, 2017.<\/li>\n
    33. T. T. Nguyen, K. Fujii and A. Pham, \u201cA 7\u201342 GHz dual-mode reconfigurable mixer with an integrated active IF balun,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 2018-2021, Honolulu, HI, 2017.<\/li>\n
    34. D. P. Nguyen, B. L. Pham and A. Pham, \u201cA compact 29% PAE at 6 dB power back-off E-mode GaAs pHEMT MMIC Doherty power amplifier at Ka-band,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1683-1686, Honolulu, HI, 2017.<\/li>\n
    35. D. P. Nguyen, A. N. Stameroff and A. Pham, \u201cA 1.5\u201388 GHz 19.5 dBm output power triple stacked HBT InP distributed amplifier,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 20-23, Honolulu, HI, 2017. <\/strong>(Student finalist paper; Student D. Nguyen and Advisor: A. Pham)<\/strong><\/li>\n
    36. D. P. Nguyen, T. Pham and A. Pham, \u201cA Ka-band asymmetrical stacked-FET MMIC Doherty power amplifier,\u201d Proceedings of IEEE Radio Frequency Integrated Circuits Symposium (RFIC)<\/em>, pp. 398-401,<\/em> Honolulu, HI, 2017.<\/li>\n
    37. M. Darwish and A. Pham, \u201cCompact and high efficiency Doherty power amplifier using a new modulation load range,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 782-784, Honolulu, HI, 2017.<\/li>\n
    38. Anh-Vu Pham, D. P. Nguyen and M. Darwish, \u201cHigh efficiency power amplifiers for 5G wireless communications,\u201d Proceedings of 10th Global Symposium on Millimeter-Waves<\/em>, pp. 83-84, Hong Kong, 2017 (Invited).<\/strong><\/li>\n
    39. C. Van Pham, A. Pham and C. S. Gardner, \u201cDevelopment of helical circular coils for wireless through-metal inductive power transfer,\u201d Proceedings of IEEE Wireless Power Transfer Conference (WPTC)<\/em>, pp. 1-3, Taipei, Taiwan, 2017.<\/li>\n
    40. B. L. Pham, D. P. Nguyen, A. Pham and P. D. Le, \u201cHigh power monolithic pHemt GaAs Limiter for T\/R Module,\u201d Proceedings of IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)<\/em>, pp. 1-4, Austin, TX, 2016.<\/li>\n
    41. D. P. Nguyen, T. Pham, B. L. Pham and A. Pham, \u201cA high efficiency high power density harmonic-tuned Ka-Band stacked-FET GaAs power amplifier,\u201d Proceedings of IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)<\/em>, pp. 1-4, Austin, TX, 2016.<\/li>\n
    42. T. Nguyen, A. Pham, K. Fujii and A. Riddle, \u201cDevelopment of a double-octave (7-34 GHz), highly linear single balanced resistive HEMT mixer using device linearization techniques,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1-4, San Francisco, CA, 2016.<\/li>\n
    43. D. P. Nguyen, T. Nguyen and A. Pham, \u201cDevelopment of a highly linear Ka-band power amplifier using second harmonic injection linearization,\u201d Proceedings of 46th European Microwave Conference (EuMC)<\/em>, pp. 835-838, London, UK, 2016.<\/li>\n
    44. Thuy Nguyen, Kohei Fujii, Anh-Vu Pham, \u201cA 6-46 GHz, high output power distributed frequency doubler using stacked FETs in 0.25um GaAs pHEMT,\u201d Proceedings of IEEE<\/em> 11th European Microwave Integrated Circuits Conference (EuMIC), <\/em>381-384, London, 2016.<\/li>\n
    45. B. Pham, D. Nguyen, P. Le and A. Pham, \u201cHigh dynamic range X-Band MMIC VGA LNA for transmit\/receive module,\u201d Proceedings of <\/em>IEEE Sixth International Conference on Communications and Electronics<\/em> (ICCE), pp. 1-3, Ha Long Bay, Vietnam, 2016.<\/li>\n
    46. Y. Kitahara, C. W. Domier, M. Ikeda, A. Pham and N. C. Luhmann,. \u201cDetection of small metal particles by a quasi-optical system at sub-millimeter wavelength,\u201d Proceedings of SPIE <\/em>Terahertz Physics, Devices, and Systems X: Advanced Applications in Industry and Defense<\/em>, Vol. 9856, p. 98560H, Baltimore, MA, April 2016.<\/li>\n
    47. B. Tobias, C. W. Domier, N. C. Luhmann Jr., C. Luo, M. Mamidanna, T. Phan, A.-V. Pham and Y. Wang. \u201cLow-noise heterodyne receiver for electron cyclotron emission imaging and microwave imaging reflectometry.\u201d Proceedings of the 21st Topical Conference on High-Temperature Plasma Diagnostics (HTPD),<\/em> Madison, Wisconsin, USA, June, 2016.<\/li>\n
    48. N. C. Luhmann, Jr., Yu-Ting Chang, Ming Chen, Xi Chena , C.W. Domier, J. Gu, Fengqi Hu, Xing Hu, G.J. Kramerb , Meijiao Li, X. Liu, M. Mamidanna, A.-V. Pham, T. Phan, Xiaoxin Ren, L. Shib , A.G. Spear, B. Tobiasb , and Yilun Zhu. \u201cAdvances in 2-D millimeter-wave plasma imaging of magnetic fusion plasmas,\u201d Proceedings of 25th International TOKI Conference<\/em>, Toki, Japan, 2015.<\/li>\n
    49. B. Tobias, G. J. Kramer, E. Valeo, C.M. Muscatello, X. Ren, M. Chen, A.G. Spear, A.-V. Pham, T. Phan, M. Mamidanna, J. Lai, M. Li, D. Fu, F. Hu, C.W. Domier, N.C. Luhmann Jr., X. Chen, N. Ferraro, A. Garofalo, S. Zemedkun, T.L. Munsat, and Y. Zhu. \u201cMicrowave imaging reflectometry (MIR) on the DIII-D tokamak,\u201d Proceedings of 1st EPS Conference on Plasma Diagnostics (ECPD)Science-ECPD<\/em>, Villa Mondragone, Frascati, Italy, April, 2015.<\/li>\n
    50. J. H. Jeon, J. T. Chang, and A. Pham, \u201cArchimedean spiral antenna with an integrated dual bandstop response,\u201d Proceedings of <\/em>IEEE International Symposium on Antennas and Propagation<\/em>, pp. 1-2, Vancouver, Canada, July 2015.<\/li>\n
    51. C. V. Pham, B. Pham, A. Pham and R. E. Leoni, \u201cA 46:1 bandwdith ratio balun on multilayer organic substrate,\u201d Proceedings of <\/em>IEEE International Microwave Symposium, <\/em>pp. 1-3, Phoenix, AZ, May 2015.<\/li>\n
    52. M. Mamidanna, A. Pham, and F. Montauti, \u201cDevelopment of a liquid crystal polymer low noise amplifier module at Ka-band,\u201d Proceedings of <\/em>IEEE International Microwave Symposium<\/em>, pp. 1-3, Tampa, FL, June 2014.<\/li>\n
    53. J. Jeon, J. Chang, and A. Pham, \u201cBand-notched UWB equiangular spiral antenna,\u201d Proceedings of <\/em>IEEE International Symposium on Antennas and Propagation<\/em>, pp. 1-2, Memphis, TN, July 2014.<\/li>\n
    54. J. Curtis, A.-V Pham, M. Chirala, F. Aryanfar, and P. Zhouyue, \u201cA Ka-band doherty power amplifier with 25.1 dBm output power, 38% peak PAE and 27% back-off PAE,\u201d Proceedings of <\/em>IEEE Radio Frequency Integrated Circuit Symposium<\/em>, pp. 349-352, Seattle, WA, June 2013.<\/li>\n
    55. M. Mamidanna, A. Pham and F. Montauti, \u201cDevelopment of a liquid crystal polymer receiver module at Ka-band,\u201d Proceedings of AIAA International Communications Satellite Systems Conference,<\/em> pp. 1-3, Florence, Italy, October 2013.<\/li>\n
    56. H. Ta, B. Pham, A.-V. Pham, and R. Leoni, \u201cA 23:1 bandwidth ratio balun on multilayer organic substrate,\u201d Proceedings of <\/em>IEEE International Microwave Symposium, <\/em>pp. 1-3, <\/em>Seattle, WA, June 2013.<\/li>\n
    57. B. Pham and A.-V. Pham, \u201cTriple bands antenna and high efficiency rectifier design for RF energy harvesting at 900, 1900 and 2400 MHz,\u201d Proceedings of <\/em>IEEE International Microwave Symposium, <\/em>pp. 1-3, Seattle, WA, June 2013.<\/li>\n
    58. V. L. Duong, A.-V. Pham, T. W. Dalrymple, M. Schadt, and C. L. Palomaki, \u201cDevelopment of a compact true time delay circuit,\u201d Proceedings of GOMAC<\/em>, pp. 1-3, Las Vegas, NV, March 2013.<\/li>\n
    59. A. Stameroff and A. Pham, \u201cWide bandwidth inverse class F power amplifier with novel balun harmonic matching network,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 1-3, Montreal, Canada, June 2012 (Student finalist paper; Student A. Stameroff and Advisor: A. Pham<\/strong>)<\/li>\n
    60. H.Ta and A. Pham, \u201cCompact wilkinson power divider on multilayer organic substrate\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 1-3, Montreal, Canada, June 2012.<\/li>\n
    61. S. Chieh and A. Pham, \u201cA W-Band 8 x 8 series fed patch array on liquid crystal polymer\u201d, Proceedings of<\/em> IEEE Antennas and Propagation Society International Symposium (APSURSI), <\/em>pp. 1-2, Chicago, Illinois, July 2012.<\/li>\n
    62. B. Pham, J. S. Chieh, and A. Pham, \u201cA wideband composite right\/left-hand rectenna for UHF energy harvesting applications\u201d Proceedings of<\/em> IEEE Antennas and Propagation Society International Symposium (APSURSI), <\/em>pp. 1-2, Chicago, Illinois, July 2012.<\/li>\n
    63. J. S. Chieh and A. Pham \u201cA bidirectional X-Band antenna array on Liquid Crystal Polymer,\u201dProceedings of<\/em> IEEE<\/em> Antennas and Propagation Society International Symposium (APSURSI)<\/em>, pp. 573-576, Spokane, WA, July 2011.<\/li>\n
    64. Y. Wang, J. S. Chieh, and A. Pham, \u201cA wideband and high gain V-band EBG patch antenna on liquid crystal polymer,\u201d Proceedings of<\/em> IEEE Antennas and Propagation Society International Symposium (APSURSI), <\/em>pp.1820-1823, Spokane, WA, July 2011.<\/li>\n
    65. J. S. Chieh, Anh-Vu Pham, T. W. Dalrymple, D. G. Kuhl, and B. B. Garber, \u201cA light weight 8-element broadband phased array receiver on Liquid Crystal Polymer,\u201d Proceedings of <\/em>IEEE International Microwave Symposium, <\/em>pp.1024-1027, Atlanta, Georgia, May 2010.<\/li>\n
    66. A. Stameroff, A. Pham, and R. E. Leoni, \u201cHigh efficiency push-pull inverse class F power amplifier using a balun and harmonic trap waveform shaping network,\u201d Proceedings of <\/em>IEEE International Microwave Symposium,<\/em> pp.521-525, <\/em>Atlanta, Georgia, May 2010.<\/li>\n
    67. C. Chen and A. Pham, \u201cK-band near-hermetic surface mount package using liquid crystal polymer for high power applications,\u201dProceedings of <\/em>IEEE International Microwave Symposium,<\/em> pp. 1280-1283, Atlanta, Georgia, May, 2010.<\/li>\n
    68. A. Pham, \u201cLiquid Crystal Polymer for microwave and millimeter-wave multi-layer packages and modules,\u201d Proceedings of <\/em>IEEE European Microwave Conference<\/em>, pp. 352-355, Paris, France, October 2010.<\/li>\n
    69. H. Ta, A. Stameroff, and A. Pham, \u201cDevelopment of a defected ground structure wide bandwidth balun on multilayer organic substrate,\u201d Proceedings of <\/em>IEEE Asia Pacific Microwave Conference (APMC)<\/em>, pp. 1641-1644, Yokohama, Japan, December 2010.<\/li>\n
    70. H. Ta, and A. Pham, \u201cCompact Wilkinson power divider based on novel via-less composite right\/left-handed (CRLH) transmission lines,\u201d Proceedings of <\/em>IEEE 3rd International Conference on Communications and Electronics<\/em>, pp. 313-317, Nha Trang, Vietnam, August, 2010.<\/li>\n
    71. C. Y. Law and A. Pham, \u201cA high-gain 60GHz power amplifier with 20dBm output power in 90nm CMOS,\u201d Proceedings of <\/em>IEEE International Solid-State Circuits Conference<\/em>, pp. 426-427, San Francisco, CA, February 2010.<\/li>\n
    72. J. S. Chieh, A.V. Pham, T. Dalrymple, K. Aihara, D. Kuhl, B. Garber, \u201cA broadband 8-Element Phased Array Antenna Receiver on Liquid Crystal Polymer in the Ka-Band,\u201d Proceedings of GOMAC<\/em>, Reno, NV, March 2010<\/li>\n
    73. J-C. S. Chieh and A. Pham, \u201cDevelopment of a broadband Wilkinson power combiner on Liquid Crystal Polymer,\u201d IEEE Asia Pacific Microwave Conference Proceedings (APMC), <\/em>2068-2071, Singapore, December 2009.<\/li>\n
    74. H. Ta and A. Pham, \u201cDevelopment of compact resonator and transmission lines based on multi-layer CRLH structure,\u201d Proceeding of IEEE Asia Pacific Microwave Conference (APMC), <\/em>pp. 127-130, Singapore, December 2009.<\/li>\n
    75. C. Chen, K. Aihara, M. McGrath, Y. Wang and A. Pham, \u201cNear hermetic high power package using Liquid Crystal Polymer for 4-Watt Ka-band amplifier with sparse thermal vias for cost reduction,\u201d IMAP Proceedings of the International Symposium on Microelectronics<\/em>, pp. 1-5, San Jose, CA, September 2009.<\/li>\n
    76. M. J. Chen, Z. Zhang, A. Pham, and D. J. Hyman, \u201cThin-film LCP amplitude compensated long time delay circuit,\u201d Proceedings of IEEE International Microwave Symposium,<\/em> pp. 141-144, Boston, MA, June 2008.<\/li>\n
    77. M. P. McGrath, K. Aihara, A. Pham and S. Nelson, \u201cDevelopment of LCP surface mount package with a bandpass feedthrough at K-band,\u201d Proceedings of IEEE International Microwave Symposium, <\/em>pp. 93-96, Boston, MA, June 2008.<\/li>\n
    78. C. Lu, O. Charlon, M. Bracey, and A.-V. H. Pham, \u201cIntegrated balun design for dual-band WLAN a\/b\/g applications,\u201d Proceedings of IEEE International on Circuits and Systems,<\/em> pp. 1296-1299, <\/em>Seattle, Washington, May 2008.<\/li>\n
    79. W. Jiang, F. M. Soares, S. W. Seo, J. H. Baek, N. K. Fontaine, R. G. Broeke, J. Cao, J. Yan, K. Okamoto, F. Olsson, S. Lourdudoss, A. Pham, and S.J.B. Yoo, \u201cA monolithic InP-Based photonic integrated circuit for optical arbitrary waveform generation,\u201d Proceedings of IEEE Optical Fiber Communications<\/em>, pp. 1-3, San Diego, CA, 2008.<\/li>\n
    80. M. P. McGrath, K. Aihara, C. Chen, Z. Zhang, M. J. Chen and A.-V. Pham, \u201cLiquid crystal polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d Proceedings of Advanced Technology Workshop on RF and Microwave Packaging<\/em>, pp. 1-4, San Diego, February, 2008. (Outstanding Student Paper)<\/strong><\/li>\n
    81. K. Aihara, A. Pham, D. Zeeb, T. Flack, and E. Stoneham, \u201cDevelopment of multi-layer liquid crystal polymer Ka-band receiver modules,\u201d Proceedings of IEEE Asia Pacific Microwave Conference (APMC), <\/em>pp. 1-4, Bangkok, Thailand, December 2007.<\/li>\n
    82. M. Chen, N. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, A. Pham, J. Maciel, and N. Karabuda, \u201cReliability of a hermetic LCP package for RF MEMS switches,\u201d Proceedings of<\/em> GOMAC<\/em>, pp. 427-430, Orlando, FL, September 2007.<\/li>\n
    83. J. Iannotti, C. Kapusta, W. Taft, A. Jacomb-Hood, M. Chen, and A. Pham, \u201cWideband passive amplitude compensated true time delay (TTD) module for active phased arrays,\u201d Proceeding of GOMAC<\/em>, pp. 199-202, Orlando, FL, September 2007.<\/li>\n
    84. S.-W Seo, F. M. Soares, J. H. Baek, W. Jiang, N. K. Fontaine, R. P. Scott, C. Yang, D. J. Geisler, J. Yan, R. Broeke, J. Cao, F. Olsson, S. Lourdudoss, A.-V. Pham, and S. J. B. Yoo, \u201cMonolithically integrated InP photonic micro systems on a chip for O-CDMA and OAWG applications,\u201d Proceedings of Photonics in Switching<\/em>, pp. 97-98, San Francisco, CA, August 2007.<\/li>\n
    85. A. Pham, \u201cDevelopment of LCP surface mount packages for Ka-band applications,\u201d Proceedings of GOMAC<\/em>, pp. 415-418, Orlando, FL, September 2007.<\/li>\n
    86. A. Chen, A. Pham, and R. Leoni, \u201c6-18 GHz push-pull power amplifier with wideband even-order distortion cancellation in LCP module,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1079-1082,<\/em> Honolulu, HI, June 2007.<\/li>\n
    87. K. Takata and A. Pham, \u201cElectrical properties and practical applications of Liquid Crystal Polymer,\u201d Proceedings of IEEE 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, <\/em>pp. 67-72, Tokyo, Japan, January 2007.<\/li>\n
    88. K. Aihara, A. Pham, and J. Roman, \u201cDevelopment of molded liquid crystal polymer surface mount packages for Ku and Ka-band applications,\u201d Proceedings of International Conference<\/em> and Exhibition on Device,<\/em> pp. 1-3, March 2006.<\/li>\n
    89. J. Cao, R.G. Broeke, N. Fontaine, W. Cong, C. Ji, Y. Du, N. Chubun, K. Aihara, A. Pham, S. J.B.Yoo, F. Olsson, S. Lourdudoss, and P.L. Stephan, \u201cError-free spectral encoding and decoding operation of InP O-CDMA encoder,\u201d Proceedings of IEEE Optical Fiber Communications<\/em> Conference<\/em>, pp. 163-166, Anaheim, CA, June 2006.<\/li>\n
    90. C. Lu, A. Pham, M. Shaw, and C. Saint, \u201cA fully integrated broadband power amplifier with two-dimensional Linearization,\u201d Proceedings of 36th European Microwave Conference<\/em>, pp. 407-410, Manchester, UK, September 2006.<\/li>\n
    91. Chao Lu, Anh-Vu Pham, and Michael Shaw \u201cA CMOS power amplifier for full-band UWB transmitters,\u201d Proceeding<\/em> of IEEE Radio Frequency Integrated Circuits (RFIC) Symposium<\/em>, pp. 397 \u2013 400, San Francisco, CA, June 2006.<\/li>\n
    92. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, \u201cDevelopment of multilayer organic modules for hermetic packaging of RF MEMS circuits,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 271 \u2013 274, San Francisco, CA, June 2006.<\/li>\n
    93. K. Aihara and A. Pham \u201cDevelopment of thin-film liquid crystal polymer surface mount packages for Ka-band applications,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp 956\u2013959, San Francisco, CA, June 2006. (Student finalist paper; Student K. Aihara and Advisor: A. Pham<\/strong>).<\/li>\n
    94. C. Lu, A. Pham, and D. Livezey, \u201cOn the linearity of CMOS multi-band phase shifters,\u201d Proceedings of<\/em> 6th topical meeting on Silicon Monolithic Integrated Circuits in RF Systems<\/em>, pp. 290 \u2013 293, San Diego, CA, January 2006.<\/li>\n
    95. S. Lourdudoss, F.Olsson, C.A.Barrios, T.Hakkarainen, A.Berrier, S.Anand, A.Aubert, J.Berggren, R. G. Broeke, J. Cao, N. Chubun, S-W Seo, J-H Baek, N. Chubun, K. Aihara, Anh-Vu Pham, S.J.Ben Yoo, M. Avella, and J. Jim\u00e9nez, \u201cHeteroepitaxy and selective epitaxy for discrete and integrated devices,\u201d Proceedings of IEEE Conference on optoelectronic and microelectronic materials and devices (COMMAD\u201906)<\/em> , pp. 1-2, Perth, Australia, December 2006.<\/li>\n
    96. M. McGrath and A. Pham, \u201cMicrowave vertically aligned carbon nanotube array sensors for ammonia detection,\u201d Proceedings of IEEE Sensors<\/em>, pp. 837-841, Irvine, CA, November 2006.<\/li>\n
    97. K. Aihara, A.C. Chen, A. Pham, and J.W. Roman, \u201cDevelopment of molded liquid crystal polymer surface mount packages for millimeter wave applications,\u201d Proceedings of 14th IEEE Electrical Performance of Electronic Packaging<\/em>, pp. 167\u2013170, Austin, TX, October 2005.<\/li>\n
    98. C. Lu, A. Pham, and D. Livezey, \u201d A Novel Multi-band Phase Shifter with Loss Compensation in 180 nm RF CMOS Technology,\u201d Proceedings of<\/em> IEEE International Midwest Symposium on Circuits and Systems<\/em>, pp. 806-809, Cincinnati, OH, August 2005.<\/li>\n
    99. M. Chen, N. Evers, C. Kapusta, J. Iannotti, A. Pham, W. Kornrumpf, J. Maciel, N. Karabudak, \u201cDevelopment of a hermetically sealed enclosure for MEMS in chip-on-flex modules using liquid crystal polymer (LCP),\u201d Proceedings of ASME Interpack<\/em>, San Francisco, CA, July 2005.<\/li>\n
    100. A. Keerti, and A. Pham, \u201cDynamic output phase to adaptively improve the linearity of the power amplifier under antenna mismatch,\u201d Proceedings of IEEE Radio Frequency Integrated Circuits (RFIC)<\/em>, pp. 675 \u2013 678, Long Beach, CA, June 2005.<\/li>\n
    101. A. C. Chen, A. Pham, and R. E. Leoni, \u201cDevelopment of a low-loss multilayered broadband balun using twin-thickness thin film\u201d, Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1243-1246, Long Beach, CA, June 2005.<\/li>\n
    102. A. C. Chen, M. Chen, A. Pham, \u201cDevelopment of microwave ultra-wide band balun using liquid crystal polymer flex,\u201d Proceedings of 55th IEEE Electronic Components and Technology<\/em>, pp. 783-787, Orlando, FL, June 2005.<\/li>\n
    103. Mark P. McGrath, Ridah N. Sabouni, and A. Pham, \u201cDevelopment of nano-based resonator gas sensors for wireless sensing systems,\u201d Proceedings of SPIE Nanosensing Materials and Devices<\/em>, pp. 62-72, Philadelphia, PA, October 2004.<\/li>\n
    104. A. Pham, \u201cRemote wireless carbon nanotube sensors,\u201d Proceedings of<\/em> IEEE Topical Conference on Wireless Communication Tech.<\/em>, pp. 233-236, Honolulu, HI, October 2003. (Invited)<\/li>\n
    105. Z. Wei and A. Pham, \u201cLiquid crystal polymer (LCP) for microwave\/millimeter wave multi-layer packaging,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 2273-2276, Philadelphia, PA, June 2003.<\/li>\n
    106. K. Aihara, J. Xiang, S. Chopra, A. Pham, and A. M. Rao, \u201cGHz carbon nanotube resonator bio-sensors,\u201d Proceedings of<\/em> IEEE Nanotechnologies Conference<\/em>, pp. 12-14, San Francisco, August 2003.<\/li>\n
    107. A. Pham, \u201cEducational modules on RF MEMS and microsystems,\u201d Proceedings of<\/em> IEEE Electronic Components and Technology Conference<\/em>, pp. 495-497, New Orleans, May 2003.<\/li>\n
    108. A. Pham, \u201cRemote wireless carbon nanotube sensors,\u201d NSF Workshop at the IEEE Topical Conference on Wireless Communication Technology<\/em>, October 2003, pp. 233-236 (Invited).<\/li>\n
    109. Z. Wei and A. Pham, \u201cLiquid crystal polymer (LCP) for microwave\/millimeter wave multi-layer packaging,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 2273-2276,<\/em> Philadelphia, PA, June 2003.<\/li>\n
    110. K. Aihara, J. Xiang, S. Chopra, A. Pham, and A. M. Rao, \u201cGHz carbon nanotube resonator bio-sensors,\u201d Proceedings of<\/em> IEEE Nanotechnologies Conference<\/em>, San Francisco, August 2003.<\/li>\n
    111. A. Pham, \u201cEducational modules on RF MEMS and microsystems,\u201d Proceedings of<\/em> IEEE Electronic Components and Technology Conference<\/em>, pp. 495-497, New Orleans, May 2003.<\/li>\n
    112. A. Venkateshan, A. Pham, and J. Harriss, \u201cDevelopment of an organic micromachined isolation scheme for wafer-level packaging,\u201d Proceedings of<\/em> IEEE Electrical Performance of Electronic Packaging Conference<\/em>, Monterey, CA, Oct. 2002.<\/li>\n
    113. R. Ramachandran and A. Pham, \u201cDevelopment of an organic wafer-level packaging platform for highly integrated RF transceivers,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 1401-1404, <\/em>Seattle, WA, June 2002.<\/li>\n
    114. S. Thumaty, A. Pham, and H. van Wyk, \u201cDevelopment of a low-IF receiver and a fixed wireless utility network,\u201d <\/strong>Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 449-452, Seattle, WA, June 2002.<\/li>\n
    115. S. Chopra, A. Pham, J. Gaillard, A. M. Rao, <\/em>\u201cNano-based Resonant Circuit Gas Sensors,\u201d Proceedings of<\/em> American Physics Society Meeting<\/em>, Indianapolis, IN, March 2002.<\/li>\n
    116. A. Pham, \u201cEducational Project: Development of a seminar course on RF MEMs and RF Microsystems,\u201d Proceedings of<\/em> IEEE Electronic Components and Technology Conference<\/em>, pp. 1401-1404, <\/strong>San Diego, CA, May 2002.<\/strong><\/li>\n
    117. S. Chopra, A. Pham, J. Gillard, and A. M. Rao, \u201cDevelopment of RF carbon nanotube resonant circuit sensors for gas remote sensing applications,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 639-642, Seattle, WA, June 2002. (Student finalist paper; Student S. Chopra and Advisor: A. Pham<\/strong>).<\/li>\n
    118. S. Manohar, A. Pham, N. Evers, \u201cEmpirical large signal model for SiC MESFETs,\u201d Proceedings of<\/em> IEEE ARFTG<\/em> Conference<\/em>, Seattle, WA, June 2002.<\/li>\n
    119. S. Manohar, A. Narayanan, A. Keerti, A. Pham, R. Borges, and K. Linthicum, \u201cCharacteristics of microwave power GaN HEMTs on large-scale Si wafers,\u201d Proceedings of IEEE International Microwave Symposium<\/em>, pp. 1401-1404, Seattle, WA, June 2002.<\/li>\n
    120. R. Ramachandran, D. Newlin and A. Pham, <\/em>\u201cDevelopment of RF\/Microwave on-chip inductors using an organic micromachining process,\u201d Proceedings of<\/em> IEEE Electrical Performance of Electronic Packaging <\/em>Conference<\/em>, Cambridge, MA, pp. 97-100, October. 2001.<\/li>\n
    121. N. Chomnawang, Sangwon Park, Kabseog Kim, J-B. Lee, and A. Pham, \u201cOn-chip RF MEMS components for high frequency applications,\u201d Proceedings of<\/em> Texas MEMS III Conference<\/em>, Richardson, TX, June 2001.<\/li>\n
    122. D. Newlin, A. Pham, J. Harriss, and J. B. Lee, \u201cDevelopment of low loss organic micromachined interconnects on Silicon at microwave frequencies,\u201d Proceedings of<\/em> IEEE RAWCON <\/em>Conference<\/em>, pp. 181-183, Boston, MA, August 2001.<\/li>\n
    123. D. Newlin, A. Pham, J. Harriss, and J. B. Lee,<\/em><\/strong> \u201cDevelopment of organic-micromachined interconnects on Si substrates at microwave frequencies,\u201d Proceedings of<\/em> 34th International Symposium on Microelectronics<\/em>, pp. 44-47, Baltimore, MD, October 2001.<\/li>\n
    124. A. Pham, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, \u201cDevelopment of a millimeter wave system-on-a-package utilizing MCM integration,\u201d Proceedings of<\/em> IEEE Electrical Performance of Electronic Packaging Conference<\/em>, pp. 277-280, Tempe AZ, October 2000.<\/li>\n
    125. S. Manohar, A. Pham, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu \u201cDevelopment of microwave\/millimeter wave integral passives for multi-layer organic MCMs,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 1879-1882, Boston MA, June 2000.<\/li>\n
    126. J. E. Harriss, L. W. Pearson, X. Wang, C. H. Barron, and A. Pham, \u201cMembrane-supported Ka-band resonator employing organic micromachined packaging,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 1225-1228, Boston MA, June 2000.<\/li>\n
    127. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, \u201cDevelopment of vertical interconnects for mixed substrate technology,\u201d Proceedings of<\/em> IEEE 54th ARFTG Conference, <\/em>pp. 132-136, Atlanta GA, December 1999.<\/li>\n
    128. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, <\/em>\u201cDevelopment of three dimensional ceramic-based MCM inductors for hybrid RF\/Microwave applications,<\/em>\u201d Proceedings of<\/em> IEEE <\/em>Radio Frequency Integrated Circuits Symposium (RFIC)<\/em>, pp. 175-178, Baltimore, MD, June 1999.<\/li>\n
    129. J. Laskar, A Sutono, A Pham, D. Staiculescu, H. Liang, D. Cresci,<\/strong> \u201cDevelopment of board level electrical models for vertical Interconnects and embedded components at microwave frequencies,\u201d Proceedings of<\/em> 26th General Assembly of the International Union of Radio Science<\/em>, Toronto, Canada, August 1999. (invited paper)<\/li>\n
    130. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, \u201cInvestigation of multi-layer ceramic based MCM technologies,\u201d Proceedings of<\/em> 7th <\/em>IEEE Electrical Performance of Electronic Packaging Conference<\/em>, pp. 83-86, West Point, NY, October 1998.<\/li>\n
    131. A. Pham, A. Mathis, J. Laskar, A. F. Peterson, and L. Hayden, \u201cMembrane probe technology for non-destructive thin-film material characterization,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 957-960, Denver, CO, June 1998.<\/li>\n
    132. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, H.S. Cole, and T. Sitnik-Nieters, \u201cDevelopment of millimeter wave multi-layer organic based MCM technology,\u201d Proceedings of<\/em> IEEE International Microwave Symposium,<\/em> pp. 1103-6, Denver, CO, June 1998.<\/li>\n
    133. D. Staiculescu, A. Pham, J. Laskar, S. Consolazio, S. Moghe, and J. Mondal, <\/em>\u201cAnalysis and performance of BGA interconnects for RF packaging,\u201d Proceedings of<\/em> IEEE<\/em> Radio Frequency Integrated Circuits Symposium (RFIC)<\/em>, pp. 131-4, Denver, CO, June 1998.<\/li>\n
    134. J. Laskar, N. Jokerst, M. Brooke, M. Harris, C. Chun, A. Pham, H. Liang, D. Staiculescu, and A. Sutono, <\/em>\u201cReview of RF packaging at Georgia Tech\u2019s PRC,\u201d Proceedings of<\/em> 4th International Symposium on Advanced Packaging Materials Processes<\/em>, pp. 139-150, Braselton, GA, March 1998.<\/li>\n
    135. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, \u201cUltra low loss millimeter wave MCM interconnects,\u201d Proceedings of<\/em> 6th <\/em>IEEE Electrical Performance of Electronic Packaging Conference<\/em>, pp. 213-216, Napa, CA, Oct. 1997.<\/li>\n
    136. A. Pham, J. Laskar, S. Basu, and J. Pence, \u201cComparison of coplanar microprobes for on-wafer measurement at millimeter wave frequencies,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 1659-1662, Denver, CO, June 1997.<\/li>\n
    137. A. Pham, C. Chun, J. Laskar, and B. Hutchison,<\/strong> \u201cSurface mount microwave package characterization technique,\u201d Proceedings of<\/em> IEEE International Microwave Symposium<\/em>, pp. 995-998, <\/em>Denver, CO,<\/em> June 1997.<\/li>\n
    138. P. Chahal, A. Haridass, A. Pham, R. Tummala, M. Allen, J. Laskar, and M. Swaminathan, <\/em>\u201cIntegration of thin film passive circuits using high\/low dielectric constant,\u201d Proceedings of<\/em> 47th IEEE Electronic Components and Technology Conference<\/em>, pp. 739-744, May 1997.<\/li>\n
    139. A. Pham, J. Laskar, G. Zhou, and B. Hutchison, \u201cDevelopment of a surface mountable plastic package characterization technique,\u201d Proceedings of<\/em> 5th <\/em>IEEE Electrical Performance of Electronic Packaging Conference<\/em>, pp. 147-149, San Jose, CA, October 1996.<\/li>\n
    140. A. Pham, J. Laskar, and J. Schappacher, \u201cDevelopment of on-wafer microstrip characterization techniques,\u201d Proceedings of<\/em> 47th IEEE ARFTG Conference<\/em>, pp. 85-94, San Francisco, CA, June 1996.<\/li>\n<\/ol>\n

      Books<\/strong><\/h4>\n
        \n
      1. Laskar, S. Chakraborty, A. Pham, and M. M. Tentzeris, Advanced Mixed Signal Communications Systems<\/em>, Hoboken, New Jersey, Wiley-Interscience, 450pp. (ISBN-10: 0471709603), 2009.<\/li>\n
      2. Anh-Vu Pham, Morgan J. Chen, and Kinia Aihara, LCP for Microwave Packages and Modules<\/em>, Cambridge, UK, Cambridge University Press, ISBN 978-1-107-00378, 2012.<\/li>\n<\/ol>\n

        Book Chapters<\/strong><\/h4>\n
          \n
        1. S. Manohar, A. Pham, J. Brown, R. Borges, and K. Linthicum, Microwave GaN-based Power Transistors on Large-Scale Silicon Wafers, in Compound Semiconductor Integrated Circuits, edited by Tho Vu, World Scientific, 2003 (Invited).<\/li>\n
        2. M.P.McGrath, K.Aihara, M.J.Chen and A.Pham, Liquid Crystal Polymer for RF and Millimeter-Wave Multi-layer Hermetic Packages and Modules in RF and Microwave Microelectronics. Springer, 26pp. (ISBN:978-1-4419-0983-1)<\/li>\n<\/ol>\n

          Selected Invited Talks<\/strong><\/h4>\n
            \n
          1. A. Pham, \u201cRF Module Integration for Wireless Communications Applications\u201d, Rutgers University, New Jersey, December 2001.<\/li>\n
          2. A. Pham, \u201cRF Module Integration for Wireless Communications Applications\u201d, University of Washington, Seattle WA, March 2002.<\/li>\n
          3. A. Pham, \u201cRF Module Integration for Wireless Communications Applications\u201d Raytheon RRFC, Andover, MA, March 2002.<\/li>\n
          4. A. Pham, \u201cA platform for developing highly integrated transceivers,\u201d IEEE International Microwave Symposium Workshop, <\/em>Seattle, WA, June 2002.<\/li>\n
          5. A. Pham, \u201cOrganic Micromachining Techniques for Microwave Components,\u201d Motorola SPS, Tempe AZ, July 2002.<\/li>\n
          6. A. Pham, \u201cPackaging for radio frequency components and sub-systems,\u201d IEEE GaAs IC Conference Panel, Monterey, CA, Oct. 2002.<\/li>\n
          7. A. Pham, \u201cLTCC and 3-D Integration for Microwave Modules\u201d, Intel Corporation, Santa Clara, CA, 2003.<\/li>\n
          8. A. Pham, \u201cMicrowave\/millimeter wave multi-layer organic system-on-a-package,\u201d DARPA Workshop on 3-D Micro Electromagnetic RF Systems, Dulles, VA, March 2003.<\/li>\n
          9. A. Pham, \u201cMicrowave\/millimeter-wave multi-layer organic system-on-a-package.\u201d Air Force Research Laboratory, Wright Patterson, August 2003.<\/li>\n
          10. A. Pham, \u201cMicrowave and millimeter wave polymer-based packaging,\u201d IEEE International Microwave Symposium Workshop, Philadelphia, PA, June 2003.<\/li>\n
          11. A. Pham, \u201cRemote wireless carbon nanotube sensors,\u201d NSF Workshop at the IEEE Topical Conference on Wireless Communication Technology<\/em>, Honolulu, HI, October 2003.<\/li>\n
          12. A. Pham, \u201cMicrowave\/millimeter-wave multi-layer organic system-on-a-package.\u201d Endwave Corporation, San Jose, CA, December 2003.<\/li>\n
          13. A. Pham, \u201cRF and millimeter wave multi-layer LCP modules and MEMS packaging,\u201d IEEE International Microwave Symposium Workshop, Long Beach, CA, June 2005.<\/li>\n
          14. A. Pham, \u201cCompact and high-density hermetic modules for microwave and millimeter wave applications,\u201d IEEE International Microwave Symposium Workshop, San Francisco, CA, June 2006.<\/li>\n
          15. A. Pham, \u201cLCP for microwave and Millimeter wave packaging,\u201d Japan Printed Circuit Association, Tokyo, Japan, January 2006.<\/li>\n
          16. A. Pham, \u201cLCP for microwave and Millimeter wave packaging,\u201d Agilent Technologies, Santa Rosa, CA, May 2006.<\/li>\n
          17. A. Pham, \u201cLCP for microwave and Millimeter wave packaging,\u201d IEEE MTT Chapter, New Hampshire Section, October 2006.<\/li>\n
          18. A. Pham, \u201cLCP for microwave and Millimeter wave packaging,\u201d General Electric Global Research Lab, October 2006.<\/li>\n
          19. A. Pham, \u201cCompact and high-density hermetic modules for microwave and millimeter-wave applications,\u201d 39TH IMAPS International Symposium on Microelectronics, June 2006.<\/li>\n
          20. A. Pham, \u201cChannel modeling for 10 GB Ethernet over copper technologies,\u201d IEEE International Microwave Symposium Workshop, San Francisco, CA, June 2006.<\/li>\n
          21. A. \u201cDevelopment of millimeter-wave surface mount packages,\u201d Emerging Packaging Technology and Applications at Millimeter Wave Frequencies, IEEE International Microwave Symposium, Honolulu, HI, June 2007.<\/li>\n
          22. A. Pham, \u201cLiquid Crystal Polymer for components and modules for communications,\u201d CITRIS in Asia Research Symposium, Taipei, Taiwan, 2007.<\/li>\n
          23. A. Pham, \u201cLCP for microwave and Millimeter wave packaging,\u201d IEEE Radio and Wireless Symposium, Workshop on Advances for RF Packaging, January 2008.<\/li>\n
          24. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE MTT Chapter, Tempe, AZ, March 2008.<\/li>\n
          25. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IMAPS Advanced Technology Workshop on RF and Microwave Packaging, September 2008.<\/li>\n
          26. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d Georgia Electronics Design Center, Georgia Institute of Technology, April 2008.<\/li>\n
          27. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d Berkeley Sensor and Actuator Center, University of California, Berkeley, March 2008.<\/li>\n
          28. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d Lockheed Martin, Palo Alto, CA February 2009.<\/li>\n
          29. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE MTT Chapter Dallas Section, Dallas, TX, February 2010.<\/li>\n
          30. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE MTT Santa Clara Chapter, Santa Clara, CA, May 2010.<\/li>\n
          31. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE MTT Chapter Cedar Rapids Chapter, Cedar Rapids, Iowa, May 2010.<\/li>\n
          32. A. Pham, \u201cDevelopment of Ultra-small wireless passive modules using 3-D organic metamaterials,\u201d IEEE International Microwave Symposium Workshop, Anaheim, CA May 2010.<\/li>\n
          33. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d Chang Gung University, Taojuan, Taiwan, July 2010.<\/li>\n
          34. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE 3rd International Conference on Communications and Electronics<\/em>, Nha Trang, Vietnam, Keynote Speaker, August 2010.<\/li>\n
          35. A. Pham, \u201cLiquid Crystal Polymer for microwave and millimeter-wave multi-layer packages and modules,\u201d IEEE European Microwave Conference<\/em>, Paris, France, September 2010.<\/li>\n
          36. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE MTT Los Angeles Coastal Chapter, Los Angeles, CA, November 2010.<\/li>\n
          37. A. Pham, \u201cLiquid Crystal Polymer for Microwave and Millimeter Wave Multi-layer Packages and Modules,\u201d University of Southern California, April 2012.<\/li>\n
          38. A. Pham, \u201cLiquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,\u201d IEEE MTT Baltimore Chapter, Baltimore, MD, May 2012.<\/li>\n
          39. A. Pham, \u201cLiquid Crystal Polymer for Microwave and Millimeter Wave Multi-layer Packages and Modules,\u201d Polytechnique Montreal University, September 2013.<\/li>\n
          40. A. Pham, \u201cLiquid Crystal Polymer for Microwave and Millimeter Wave Multi-layer Packages and Modules,\u201d Stanford University, November 2014.<\/li>\n
          41. A. Pham, D. P. Nguyen and M. Darwish, \u201cHigh efficiency power amplifiers for 5G wireless communications,\u201d 10th Global Symposium on Millimeter-Waves<\/em>, Hong Kong, May 2017.<\/li>\n
          42. A. Pham, D. P. Nguyen and M. Darwish, \u201cHigh Efficiency Power Amplifiers and Front-end Module Circuits for 5G Wireless Communications,\u201d Front-end Module for 5G Workshop, IEEE International Microwave Symposium, Honolulu, HI, 2017.<\/li>\n
          43. A. Pham, D. P. Nguyen and M. Darwish, \u201cHigh Efficiency Power Amplifiers and Front-end Module Circuits for 5G Wireless Communications\u201d High Efficiency mm-Wave Power Amplifiers for 5G<\/em>, IEEE European Microwave Conference Workshop, Madrid, Spain, 2018.<\/li>\n
          44. T.<\/li>\n<\/ol>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

            Publications Referred Journals                                                                           Referred Conference Proceedings Books and Book Chapters                    […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"inline_featured_image":false,"footnotes":""},"class_list":["post-36","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/pages\/36","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/comments?post=36"}],"version-history":[{"count":82,"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/pages\/36\/revisions"}],"predecessor-version":[{"id":1174,"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/pages\/36\/revisions\/1174"}],"wp:attachment":[{"href":"https:\/\/faculty.engineering.ucdavis.edu\/pham\/wp-json\/wp\/v2\/media?parent=36"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}